The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Sep. 21, 2016
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventor:
Kohichi Ohsumi, Yasu, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); G06K 9/00 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); H05K 1/0366 (2013.01); H05K 3/4644 (2013.01); H05K 1/162 (2013.01); H05K 2201/017 (2013.01); H05K 2201/029 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A wiring board for a fingerprint sensor includes a core insulating layer having a thickness of 30 μm to 100 μm, an inner buildup insulating layer having a thickness of 17 μm to 35 μm, an outer buildup insulating layer having a thickness of 7 μm to 25 μm, a plurality of fingerprint reading outer strip-shaped electrodes, a plurality of fingerprint reading inner strip-shaped electrodes, and an upper solder resist layer covering the outer strip-shaped electrodes by a thickness of 3 μm to 15 μm.