The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Feb. 21, 2012
Kohichi Ohsumi, Yasu, JP;
Kazunori Hayashi, Yasu, JP;
Tomoharu Tsuchida, Yasu, JP;
Kyocera SLC Technologies Corporation, Shiga, JP;
Abstract
A method of manufacturing a printed circuit board includes forming a through holein an insulating layerhaving upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductorto be deposited at least in the through holeand on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor, while leaving at least the first plated conductorin a mid-portion in a vertical direction within the through hole; and forming by semi-additive method a second plated conductorthat fills an outer portion than the first plated conductorin the through hole, and forms a wiring conductor on the upper and lower surfaces.