Kohei Tsujimoto

Title: Kohei Tsujimoto: Innovator in Wafer Processing Technology

Introduction

Kohei Tsujimoto is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing technology. With a total of 3 patents to his name, Tsujimoto continues to push the boundaries of innovation in this specialized area.

Latest Patents

Tsujimoto's latest patents include a novel processing method of a wafer. This method involves sticking an adhesive tape to the front surface of a wafer and using a thermocompression bonding sheet. The sheet is heated and pressed to execute pressure bonding, integrating it with the wafer. Additionally, the method includes grinding the wafer to a desired thickness while supplying grinding water to its back surface. Another patent focuses on a method of processing a wafer that has a device area with multiple devices formed within it. This method includes a grinding step that forms a first portion corresponding to the device area and an annular second portion that is thicker and more protrusive.

Career Highlights

Kohei Tsujimoto is currently employed at Disco Corporation, where he applies his expertise in wafer processing. His work has been instrumental in advancing the technology used in semiconductor manufacturing. Tsujimoto's innovative approaches have garnered attention in the industry.

Collaborations

Some of Tsujimoto's notable coworkers include Ryosuke Nishihara and Minoru Matsuzawa. Their collaborative efforts contribute to the ongoing advancements in wafer processing technologies.

Conclusion

Kohei Tsujimoto is a key figure in the field of wafer processing, with a focus on innovative methods that enhance manufacturing efficiency. His contributions continue to shape the future of semiconductor technology.