Kitaibaraki, Japan

Kodai Yamagishi

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Jx Advanced Metals Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kodai Yamagishi. Retrieved from https://idiyas.com/inventor/kodai-yamagishi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kodai Yamagishi: Semiconductor Materials Inventor

Introduction

Kodai Yamagishi is an inventor based in Kitaibaraki, Japan. His patent work concerns indium phosphide substrates, a material used in semiconductor technologies.

Latest Patents

Yamagishi is associated with 1 patent: “Indium Phosphide Substrate, Method for Manufacturing Indium Phosphide Substrate, and Semiconductor Epitaxial Wafer.” The invention describes a substrate with an edge-part surface roughness of no more than 0.15 μm root mean square height (Sq), measured across the entire edge surface using laser microscopy. The approach is intended to reduce contamination of the substrate surface caused by residues at its edge.

Career Highlights

Yamagishi is associated with JX Advanced Metals Corporation. His patent reflects work on substrate manufacturing and surface quality for semiconductor materials.

Collaborations

Kenji Suzuki and Shunsuke Oka are identified as Yamagishi’s coworkers.

Conclusion

Kodai Yamagishi’s patent focuses on controlling edge roughness in indium phosphide substrates to help prevent residue-related contamination and support semiconductor wafer manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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