Ko-Lun Liao

Title: Innovations of Ko-Lun Liao

Introduction

Ko-Lun Liao is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of packaging technology, particularly in semiconductor packaging. His innovative approach has led to the development of a unique package structure that enhances the performance and reliability of electronic devices.

Latest Patents

Ko-Lun Liao holds a patent for a "Package structure and manufacturing method thereof." This patent describes a package structure that includes a base, a chip, a control element, and an underfill. The chip is positioned on the base and features a recess with a bottom surface and sidewall. The control element is strategically placed between the base and the chip, resting on the bottom surface of the recess, while a gap exists between the control element and the sidewall. The underfill is then disposed within the recess, ensuring that both the chip and the control element are electrically connected to the base.

Career Highlights

Ko-Lun Liao is currently employed at Powertech Technology Inc., a leading company in the semiconductor packaging industry. His work at Powertech has allowed him to focus on innovative packaging solutions that meet the demands of modern electronics. His expertise in this area has positioned him as a valuable asset to the company.

Collaborations

One of his notable coworkers is Pei-Hsun Chou, with whom he has likely collaborated on various projects within the company. Their combined expertise contributes to the advancement of packaging technologies at Powertech.

Conclusion

Ko-Lun Liao's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to enhancing electronic device performance. His work at Powertech Technology Inc. continues to influence the industry positively.