The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Aug. 19, 2021
Applicant:
Powertech Technology Inc., Hsinchu County, TW;
Inventors:
Pei-Hsun Chou, Hsinchu County, TW;
Ko-Lun Liao, Hsinchu County, TW;
Assignee:
POWERTECH TECHNOLOGY INC., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 24/32 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01);
Abstract
A package structure and a manufacturing thereof are provided. The package structure includes a base, a chip, a control element and an underfill. The chip is disposed on the base and includes a recess, and the recess has a bottom surface and a sidewall. The control element is disposed between the base and the chip and disposed on the bottom surface of the recess, and a gap exists between the control element and the sidewall of the recess. The underfill is disposed in the recess. The chip and the control element are electrically connected to the base respectively.