Company Filing History:
Years Active: 2023
Title: Pei-Hsun Chou: Innovator in Package Structure Technology
Introduction
Pei-Hsun Chou is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of package structure technology, particularly through his innovative patent.
Latest Patents
Pei-Hsun Chou holds a patent for a "Package structure and manufacturing method thereof." This invention provides a package structure that includes a base, a chip, a control element, and an underfill. The chip is positioned on the base and features a recess with a bottom surface and a sidewall. The control element is located between the base and the chip, resting on the bottom surface of the recess, while a gap exists between the control element and the sidewall of the recess. The underfill is placed within the recess, ensuring that both the chip and the control element are electrically connected to the base.
Career Highlights
Pei-Hsun Chou is currently employed at Powertech Technology Inc., where he continues to develop innovative solutions in the field of semiconductor packaging. His work has been instrumental in advancing technology in this area.
Collaborations
Pei-Hsun Chou collaborates with Ko-Lun Liao, a talented woman in the field, contributing to the development of cutting-edge technologies.
Conclusion
Pei-Hsun Chou's contributions to package structure technology exemplify his innovative spirit and dedication to advancing the field. His patent reflects a significant step forward in semiconductor packaging solutions.