Ko Chun Liu

Title: Ko Chun Liu - Innovator in High-Density Capacitor Technology.

Introduction

Ko Chun Liu is an inventor based in Toufen Town, Taiwan. He is known for his innovative work in the field of capacitors, particularly focusing on high-density capacitor technology. Although he currently holds no granted patents, his contributions to the field are noteworthy.

Latest Patent Applications

One of his significant patent applications is titled "HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME." This application describes an embodiment of a high-density capacitor that includes a bottom electrode with a plurality of non-concentric cylindrical portions. The top electrode consists of multiple vertical portions and a surrounding portion, with a dielectric layer separating the two electrodes. Each non-concentric cylindrical portion features an inner shell and an outer shell, while the vertical portions are surrounded by the inner shell of the respective cylindrical portion. The surrounding portion of the top electrode vertically surrounds each of the non-concentric cylindrical portions, ensuring that adjacent portions are separated by this surrounding structure. Notably, some of the non-concentric cylindrical portions exhibit a spatial distribution with hexagonal symmetry.

Conclusion

Ko Chun Liu's work in high-density capacitor technology showcases his innovative spirit and dedication to advancing electrical components. His patent application reflects a unique approach to capacitor design, which may have significant implications for future developments in the field.