This inventor holds 3 USPTO granted patents. Top assignees: Ngk Insulators, Inc., Japan Atomic Energy Institute, Agency of Industrial Science and Technology Japan Atomic Energy Research. Active years: 1999-2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:


Years Active: 1999-2000
Title: Kiyotoshi Nishida: Innovator in Beryllium-Copper Bonding Technologies
Introduction
Kiyotoshi Nishida is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of materials science, particularly in the development of bonding materials for nuclear fusion applications. With a total of 3 patents to his name, Nishida's work is recognized for its innovative approach to solving complex engineering challenges.
Latest Patents
One of Nishida's latest patents is a beryllium-copper bonding material. This invention is designed for bonding pure beryllium to a copper alloy. It features a functionally gradient beryllium-copper material that can comprise a single layer or multiple layers with a thickness ranging from 0.3 to 3.0 mm. The material contains at least 50 atomic % of copper, which helps prevent the degradation of bonding strength during the bonding process or while operating in a nuclear fusion reactor. This innovation effectively mitigates the formation of brittle intermetallic compounds and reduces thermal stress at the bonding interface. Another significant patent is a process for preparing metallic beryllium pebbles, which further showcases his expertise in material applications.
Career Highlights
Throughout his career, Kiyotoshi Nishida has worked with prominent organizations such as NGK Insulators, Inc. and the Japan Atomic Energy Institute. His experience in these institutions has allowed him to develop and refine his innovative ideas, contributing to advancements in materials used in high-stakes environments like nuclear fusion.
Collaborations
Nishida has collaborated with several talented individuals in his field, including Hiroshi Kawamura and Naoki Sakamoto. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Kiyotoshi Nishida's contributions to the field of materials science, particularly in beryllium-copper bonding technologies, highlight his innovative spirit and dedication to advancing engineering solutions. His patents reflect a deep understanding of material properties and their applications in critical industries.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile