Ngk Insulators, Inc.

Japan Atomic Energy Research Institute

Agency of Industrial Science and Technology Japan Atomic Energy Research

Kiyotoshi Nishida

Hiroshi Kawamura

Naoki Sakamoto

Etsuo Ishitsuka

For bonding pure beryllium to a copper alloy, a functionally gradient beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy to prevent bonding strength from degrading in the bonding process or during operation of a nuclear fusion reactor, by effectively mitigating formation of brittle intermetallic compounds and generation of thermal stress at the bonding interface.

Beryllium-copper bonding material

Process for preparing metallic beryllium pebbles

For bonding pure beryllium to a copper alloy, a beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy to prevent bonding strength from degrading in the bonding process or during operation of a nuclear fusion reactor, by effectively mitigating formation of brittle intermetallic compounds and generation of thermal stress at the bonding interface.

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Nagoya, Japan

Kiyotoshi Nishida