The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1999
Filed:
Feb. 16, 1996
Applicant:
Inventors:
Assignees:
Japan Atomic Energy Research Institute, , JP;
NGK Insulators, Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D / ; C22F / ;
U.S. Cl.
CPC ...
148516 ; 148521 ; 148536 ; 228194 ; 428618 ; 428675 ;
Abstract
For bonding pure beryllium to a copper alloy, a beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy to prevent bonding strength from degrading in the bonding process or during operation of a nuclear fusion reactor, by effectively mitigating formation of brittle intermetallic compounds and generation of thermal stress at the bonding interface.