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For the Inventor, By the Inventor

Shizuoka, Japan

Kiyokazu Ikeya

This inventor holds 32 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Texas Instruments Corporation, Sensata Technologies, Inc., Other. Active years: 1987-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kiyokazu Ikeya. Retrieved from https://idiyas.com/inventor/kiyokazu-ikeya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32

% Patents Active = 90.6

Average Co-Inventor Count = 1.6

ph-index = 15

Forward Citations = 549(Granted Patents)


Location History:

  • Ueno, JP (1989)
  • Sunto, JP (1996)
  • Suntoh-gun, JP (1997)
  • Sunto-gun, JP (2002)
  • Shizuoka-ken, JP (1997 - 2009)
  • Shizuoka, JP (1987 - 2013)

Company Filing History:

goldMedal29 out of 29,888 
 
Texas Instruments Corporation
 patents
silverMedal2 out of 217 
 
Sensata Technologies, Inc.
 patents
bronzeMedal1 out of 834,513 
Other
 patents

Years Active: 1987-2013

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Areas of Expertise:
Semiconductor Device
Burn-In Test Socket
Socket Adaptor
Contact Assembly
Electronic Device
IC Packages
Test Socket
Conductive Terminals
Plug-In Socket
Mounting Electronic Packages
Improved Contact Engagement
Detachable Socket
32 patents (USPTO):Explore Patents
1. 8388365 - Semiconductor device burn-in test socket (2013-03-05),
2. 7601008 - Socket adaptor apparatus (2009-10-13),
3. 7217140 - Contact assembly and socket for use with semiconductor packages (2007-05-15),
4. 6848928 - Socket (2005-02-01),
5. 6749443 - Socket for mounting an electronic device (2004-06-15),
6. 6666691 - Socket for removably mounting electronic packages (2003-12-23),
7. 6614247 - Socket apparatus and method for removably mounting an electronic package (2003-09-02),
8. 6439897 - Socket apparatus for removably mounting electronic packages with improved contacting system (2002-08-27),
9. 6402537 - Socket for removably mounting an electronic part (2002-06-11),
10. 6350138 - Socket for removably mounting electronic parts having a plurality of conductive terminals such as BGA packages (2002-02-26),
11. 6322384 - Electrical socket apparatus (2001-11-27),
12. 6287127 - Electrical socket apparatus (2001-09-11),
13. 6280219 - Socket apparatus for IC packages (2001-08-28),
14. 6027355 - Socket apparatus for removably loading electric parts (2000-02-22),
15. 5816828 - Socket (1998-10-06),

Title: The Innovative Journey of Kiyokazu Ikeya

Introduction: Kiyokazu Ikeya, a distinguished inventor hailing from Shizuoka, Japan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Kiyokazu Ikeya holds several patents in the areas of electronics and telecommunications, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: Throughout his illustrious career, Kiyokazu Ikeya has been recognized for his pioneering work in developing cutting-edge solutions that have revolutionized the industry. His dedication to innovation has led to the creation of products that have greatly impacted the lives of many.

Collaborations: Kiyokazu Ikeya has collaborated with leading technology companies and research institutions, fostering a culture of creativity and excellence in the pursuit of groundbreaking inventions. His collaborative efforts have resulted in the development of innovative technologies that have set new industry standards.

Conclusion: In conclusion, Kiyokazu Ikeya's relentless pursuit of innovation and his remarkable contributions to the field of technology have solidified his position as a visionary inventor whose work continues to inspire future generations of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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