Texas Instruments Corporation

Sensata Technologies, Inc.

Other

Kiyokazu Ikeya

Hideyuki Takahashi

Hideki Sano

Toyokazu Ezura

Masao Tohyama

Masanori Yagi

Ikuo Mori

Francois A Padovani

Tomohiro Nakano

Kiyoshi Adachi

Takashi Tonooka

Osamu Yamazaki

Yasushi Hibino

Masahiro Fuchigami

Hidekazu Iwasaki

Kyozo Katayose

Kunio Kobayashi

Takeyoshi Atobe

Shinji Tsuboi

Yasuhiro Ochiai

Fujio Katsumata

Provided is a socket which protects an upper surface of a semiconductor device from being scratched due to contact, by using a latch plate. A socket () includes a base member (), a cover member () that reciprocates in a direction to be close to or separated from the base member (), a plurality of contacts (), an adaptor () that moves in a direction to be close to or separated from the base member and provides a surface for placing a semiconductor package, a latch member () that rotationally shifts with reciprocation of the cover member (), and a latch plate () connected to the latch member (). The latch plate () prevents the leading edge of the latch member () from being directly brought into contact with a Ball Grid Array (BGA), and presses down the BGA placed on the adaptor () in the vertical direction.

Semiconductor device burn-in test socket

A socket adaptormade of an electrically insulating material has a main adaptor bodyon which a plurality of through holescontaining an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pinand coil springis placed in each through hole. An electrical engagement clipping partfor clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin. The coil springis installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.

Socket adaptor apparatus

In a contact assembly, a first set of contacts (-through-) is arranged on a first surface and a second set of contacts (-through-) is arranged on a second surface with respective contacts of each set used as pairs. A plurality of first and second sets are stacked one on top of another separated by insulators, the first terminal portions () of respective first and the second sets of contacts are aligned in the direction of stacking and the second terminal portions () of the first and second sets of contacts are arranged in such a fashion as to be symmetrical relative to a median line. The pitch (P) of the second terminal portions () of the first and the second sets of contacts is expanded to a greater degree than the pitch (P) of the first terminal portions () in two preferred embodiments. The pitch of the second terminal portions of a contact assembly () having two first and two second sets of contacts is also shown expanded in the stacking direction in one embodiment forming a zigzag pattern of the second terminal portions.

Contact assembly and socket for use with semiconductor packages

A test socketof the present invention includes a base member, a cover memberwhich is installed on baseto move in reciprocal straight line movement between a first position away from the base and a second position adjacent the base and a plurality of contact membersthat are fixed in the base and are capable of making contact with terminalson a semiconductor devicewhen such deviceis mounted on base. A latch memberis supported on basein a rotatable manner to move in linkage with the movement of cover member. A compression memberis pivotably attached to a tip portionof latch memberfor pressing semiconductor partonto baseto achieve reliable contacting between terminalsand contactsin response to movement of cover member. This socket design will provide for wide area engagement between the surface of semiconductor partand compression memberto prevent damage to the semiconductor partduring testing.

Socket

A socket ( ) has a base member ( ), a cover member ( ) which is mounted for alternating motion toward and away from base member ( ), a plurality of contacts ( ) having an end fixed to the base member ( ), a contact regulating member ( ) that regulates the position of the movable ends ( ) of the contact and an adaptor ( ) having a seating surface, the adaptor which is mounted for alternating motion toward and away from the contact regulating member ( ). When adaptor ( ) is removed from the contact regulating member, the movable ends of the contacts do not protrude through the seating surface and when adaptor ( ) has been moved toward the contact regulating member ( ), the movable ends of the contacts protrude from each through-hole ( ) of adaptor ( ) for engagement with the solder balls of a BGA device ( ), placed on the adaptor ( ). The cover member is linked to the base member and latches ( ) having a BGA device pressing tip ( ) are rotatable with movement of the cover. The latches have a first fulcrum ( ) for a first segment of motion and a second different fulcrum ( ) for a second segment of motion.

Socket for mounting an electronic device

A socket ( ) has a base ( ) on which rows of contact pins are arranged, the contact pins being elastically deformable in the vertical direction, an adaptor ( ) having rows of contact holes ( ) arranged extending through a seating surface ( ) and which is capable of vertical movement relative to the base ( ) so that contact tips ( ) of contact pins ( ) can move in respective contact holes ( ). Latches ( ) are arranged to be able to press the IC package on the seating surface ( ) of the adaptor ( ) and a vertically movable regulator ( ) is arranged at a selected position relative to adaptor ( ) when stop surfaces ( ) of the regulator are engaged with a part ( ) of the contact pins ( ) so as to regulate the position of the contact tips ( ) in the contact holes ( ).

Socket for removably mounting electronic packages

A socket ( ) has a plurality of contacts ( ) arranged in base ( ). Each contact has one arm ( ) for contacting a solder ball of an electronic package ( ). A slider ( ) has a seat ( ) for package ( ), a plurality of terminal receiving holes ( ), a terminal engagement surface ( ) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes ( ). When slider ( ) is moved in one directions package ( ) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm ( ) and a terminal engagement surface ( ).

Socket apparatus and method for removably mounting an electronic package

A socket ( ) has a base ( ) which forms a recess ( ) for receiving a support member ( ). The support member ( ) has a recessed surface ( ) for carrying a contact film ( ) and has bores for mounting spring contact elements ( ). The spring contact elements engage contact members ( ) of contact film ( ) from below the film. An adapter ( ) has a seat ( ) for a BGA package ( ) for exposing solder balls ( ) to contact members ( ) from a location above the film. Socket terminal pins ( ) are electrically connected to spring contact elements ( ) through circuit paths ( ) on a pitch expansion substrate ( ). A cover ( ) and a compression member ( ) apply a force to the package.

Socket apparatus for removably mounting electronic packages with improved contacting system

A socket ( ) for removably mounting a BGA package. A plurality of contacts ( ) are mounted in a base ( ), the contacts each having a pair of arms ( and ) for effecting compressive electrical contact of the solder balls of the BGA package being held. A slider ( ) is slidably mounted on the base ( ) for opening and closing of the arms. An external force is applied in a prescribed direction at a cam follower portion ( ) of the slider by a cam member ( ) provided on a diagonal line of a generally square base ( ). The cam engages the cam follower portion ( ) of the slider at a selected angle of inclination and is movable in a direction which crosses, at a right angle, the moving direction of the slider.

Socket for removably mounting an electronic part

A socket having a base ( ) which can removably mount a BGA package ( ) and a plurality of contact members ( ) which are arranged in conformity with the pattern of terminal solder balls ( ) of BGA package ( ) on base ( ) and which have a pair of arms ( ) and ( ) that are capable of opening or closing for pressure contact in the state of sandwiching each terminal of BGA package ( ). Partition walls ( ) are provided on slider ( ) which is capable of moving in a direction normal to the opening and closing direction of arms ( ) and ( ), the partition walls engage with the pairs of arms of the contact maker ( ) respectively, with the arms ( ) and ( ) being opened or closed by the movement of the partition wall.

Socket for removably mounting electronic parts having a plurality of conductive terminals such as BGA packages

A socket (,) includes an adaptor (,) which has a seating surface (,) for an IC (,) and which has a plurality of contact member receiving holes (,) in the seating surface. The tips (,) of a plurality of contact members (,) are received through the contact member receiving holes (,) of the adaptor, with contact established with each respective terminal (,) of the IC (,) that has been placed on the seating surface. The IC on the seating surface is held by means of rotary latches (,). The latches (,) have an opened position for placement of the IC on the seating surface of the adaptor and a closed position for holding the IC from above it, rotating about a shaft (,) fixed to the base. A cover (,) is movable between first and second positions and a links (,) connected to the cover (,) open the latches when the cover is at a first position and close the latches when the cover is at a second position.

Electrical socket apparatus

A socket (,) includes a body (,) and a cover (,). Body (,) has a base (,) having a horizontally movable slide (,) thereon on which a BGA package can be mounted and a plurality of contact members (,) arranged on base (,) corresponding to a pattern of solder balls of the BGA package. Each of contact members (,) has a pair of spring arms (,) which can be opened and closed in response to movement of slide (,). In one embodiment, a cover (,) is vertically movable relative to body (,). The cover (,) has motion transfer portions (,) having a wedge shape which are engageable with tapered force receiving portions (,) of slide(,). As cover (,) is pushed down, engagement surfaces (,) of motion transfer portions (,) engage force receiving surfaces (,) of slide (,) and slide (,) moves so that arms (,) of contact members (,) are opened. In another embodiment, the motion transfer parts (,) are provided on a head (,) which has an air suction holder for a BGA package.

A socket (,) having a base (,), an adapter (,) which has a mounting seat for a semiconductor device (,) and which is installed on the base, and a plurality of contact members (,) which are caused to engage respective terminals of the semiconductor device that has been placed on the mounting seat of the adapter. Each contact member (,) has a pair of arms (,) provided by the bifurcation of one end, with the other end being fixed to the base. Each contact member is caused to nip a respective terminal (,) of the semiconductor device arranged on the mounting seat at the tip portion of the pair of arms and has butting surfaces (,) that determine the minimum spacing distance of the tip portions of the arms on the opposing sides of each pair of arms. Contact members (,) are connected to socket terminals (,) via a connector including an expansion board (,), conductive wires (,), flexible printed substrate (,), sockets (,) and lead guides (,) in several embodiments.

Socket apparatus for IC packages

A plurality of contacts (6) are arranged on a base (2) in conformity with a pattern of solder ball terminals (11) of a BGA package (9). Each contact (6) has a pair of arms (6a and 6b) which flexibly open or close to effect contact disengagement or compressive contact engagement sandwiching the solder balls of the BGA package. A slide member (4) which is capable of sliding in the opening and closing direction of the arms (6a and 6b) of the contacts (6) is provided on the base and is constructed in such a way that the arms (6a and 6b) of each contact run through the slide member (4). A lead guide (7) is vertically slidable on positioning parts (2a) depending downwardly from the base (2) for receiving lead portions (6d) in upper, relatively larger bore portions (70a) and guiding the lead portions as the body is mounted on a circuit board substrate.

Socket apparatus for removably loading electric parts

A socket (2, 52) for attachment to a printed substrate (10, 60), has a central aperture therethrough. A connective part (3, 53) including a flexible insulative sheet (8, 58) is provided to cover the aperture and act as an electrically connective interface between an electrical part (31, 81) mounted in the socket and the printed substrate. The flexible sheet (8, 58) has a first contact means (5, 55) associated with a first surface of the flexible sheet for electrically connecting with leads (32, 82) of the electrical part and a second contact means (6, 56) associated with a second surface of the flexible sheet for electrically connecting with the printed substrate. An electroconductive member (7, 57) provides electrical connection between the first and second contact means. Such a socket is especially useful for testing electrical parts with high clock speeds and a large number of leads.

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Shizuoka, Japan

Kiyokazu Ikeya