The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6614247 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 02, 2003

Filed:

Oct. 22, 2001
Applicant:
Inventors:

Kiyokazu Ikeya, Shizuoka, JP;

Kyozo Katayose, Ichikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/102 ;
U.S. Cl.
CPC ...
G01R 3/102 ;
Abstract

A socket ( ) has a plurality of contacts ( ) arranged in base ( ). Each contact has one arm ( ) for contacting a solder ball of an electronic package ( ). A slider ( ) has a seat ( ) for package ( ), a plurality of terminal receiving holes ( ), a terminal engagement surface ( ) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes ( ). When slider ( ) is moved in one directions package ( ) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm ( ) and a terminal engagement surface ( ).


Find Patent Forward Citations

Ikeya, Kiyokazu. (2003). Socket apparatus and method for removably mounting an electronic package (U.S. Patent No. 6614247). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6614247

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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