Company Filing History:
Years Active: 2003
Title: Kyozo Katayose: Innovator in Electronic Package Mounting Technology
Introduction
Kyozo Katayose is a notable inventor based in Ichikawa, Japan. He has made significant contributions to the field of electronic packaging through his innovative designs and patents. His work primarily focuses on enhancing the efficiency and reliability of electronic connections.
Latest Patents
Kyozo Katayose holds a patent for a "Socket apparatus and method for removably mounting an electronic package." This invention features a socket with multiple contacts arranged in a base. Each contact is designed with an arm that contacts a solder ball of an electronic package. The slider mechanism allows for precise seating of the package, ensuring that each solder ball is properly engaged with the terminal receiving holes. This design improves the reliability of electronic connections and simplifies the mounting process.
Career Highlights
Kyozo Katayose is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of electronic packaging. His work has been instrumental in developing technologies that enhance the performance of electronic devices. He has a proven track record of successful inventions that address industry challenges.
Collaborations
Kyozo has collaborated with Kiyokazu Ikeya, contributing to advancements in electronic packaging technology. Their partnership has led to the development of innovative solutions that benefit the industry.
Conclusion
Kyozo Katayose is a distinguished inventor whose work in electronic package mounting technology has made a significant impact. His patent and ongoing contributions at Texas Instruments Corporation highlight his dedication to innovation in the field.