Khiam-How Low

Title: Innovations of Khiam-How Low

Introduction

Khiam-How Low is an accomplished inventor based in Boise, ID (US). He has made significant contributions to the field of chemical-mechanical polishing systems. His innovative approach has led to the development of a unique patent that enhances the efficiency of wafer polishing processes.

Latest Patents

Khiam-How Low holds a patent for a "Polishing system, polishing pad, and related methods." This chemical-mechanical polishing system features a rotatable head for mounting a wafer, a polishing pad mounted to a rotatable platen, and a fluid dispenser for applying fluid onto the polishing pad's surface. The polishing pad is equipped with an array of piezoelectric actuators. The system includes a controller that measures voltages from the piezoelectric actuators, determines the wafer surface's topography, and adjusts the polishing pad's aggressiveness accordingly. This innovative design allows for precise control over the polishing process, improving the overall quality of the wafers.

Career Highlights

Khiam-How Low is currently employed at Micron Technology Incorporated, where he continues to push the boundaries of innovation in semiconductor manufacturing. His work has been instrumental in advancing the technology used in wafer polishing, which is critical for the production of high-performance electronic devices.

Collaborations

Throughout his career, Khiam-How Low has collaborated with talented individuals such as Swetha Barkam and James A Cultra. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Khiam-How Low's contributions to the field of chemical-mechanical polishing systems exemplify the spirit of innovation. His patent and work at Micron Technology Incorporated highlight his commitment to advancing technology in the semiconductor industry.