The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Jan. 28, 2019
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Swetha Barkam, Boise, ID (US);

Khiam-How Low, Boise, ID (US);

James A. Cultra, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 37/26 (2012.01); H01L 21/306 (2006.01); B24B 41/06 (2012.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 37/26 (2013.01); B24B 41/06 (2013.01); H01L 21/30625 (2013.01);
Abstract

A chemical-mechanical polishing system includes a rotatable head for mounting a wafer thereto, a polishing pad mounted to a rotatable platen, and a fluid dispenser for dispensing a fluid onto a surface of the polishing pad. The polishing pad includes an array of piezoelectric actuators. The chemical-mechanical polishing system includes a controller operably coupled to each piezoelectric actuator. The controller measures voltages output by the piezoelectric actuators of the array, determines, qualitatively, a topography of the wafer surface based on the measured voltages, and adjusts an aggressiveness of at least one portion of the polishing pad based on the determined topography. The controller adjusts the aggressiveness by inducing the piezoelectric effect or reverse piezoelectric effect in one or more piezoelectric actuators to adjust a surface topography of the polishing pad.


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