This inventor holds 4 USPTO granted patents. Top assignee: Octavo Systems LLC. Active years: 2021-2026.
Company Filing History:
Years Active: 2021-2026
Title: Kevin Michael Troy: Innovator in System-in-Package Technologies
Introduction
Kevin Michael Troy is a notable inventor based in College Station, TX (US). He has made significant contributions to the field of system-in-package (SiP) technologies, holding a total of 4 patents. His work focuses on enhancing the functionality and efficiency of electronic devices through innovative designs and methods.
Latest Patents
One of Kevin's latest patents is titled "Component communications in system-in-package systems." This invention involves a power management device and microprocessor within a SiP that are equipped with communication signals available as outputs. This allows for configuration by an external device. Additionally, he has developed methods for configuring SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP.
Another significant patent is "Automatic test equipment method for testing system in a package devices." This patent outlines systems, methods, and computer program products aimed at testing a SiP using an Automatic Test Equipment (ATE) machine. The process involves loading a functional representation of tests into a memory on a load board, which is then used on the ATE machine. A test controller retrieves and stores the tests to be performed in the SiP and conducts them accordingly.
Career Highlights
Kevin Michael Troy is currently employed at Octavo Systems LLC, where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the capabilities of SiP technologies, making them more efficient and easier to test.
Collaborations
Throughout his career, Kevin has collaborated with talented individuals such as Peter Robert Linder and Erik James Welsh. These collaborations have contributed to the development of cutting-edge technologies in the industry.
Conclusion
Kevin Michael Troy is a distinguished inventor whose work in system-in-package technologies has led to multiple patents and advancements in electronic device functionality. His contributions continue to shape the future of the industry.
