The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
May. 01, 2018
Applicant:
Octavo Systems Llc, Sugar Land, TX (US);
Inventors:
Erik James Welsh, Bellaire, TX (US);
Kevin Michael Troy, College Station, TX (US);
Assignee:
OCTAVO SYSTEMS LLC, Sugar Land, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0268 (2013.01); H05K 1/111 (2013.01); H05K 1/114 (2013.01); H05K 1/119 (2013.01); H05K 3/0005 (2013.01); H01L 25/18 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09309 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10704 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01);
Abstract
Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.