Octavo Systems LLC

Kevin Michael Troy

Peter Robert Linder

Erik James Welsh

A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

Component communications in system-in-package systems

Systems, methods, and computer program products directed to testing a System-in-a-Package (SIP) using an Automatic Test Equipment (ATE) machine. A functional representation of one or more tests to be performed in the SIP is loaded in a memory located on a load board, the load board located on the ATE machine. A test controller located on at least one of the SIP and the load board is caused to retrieve and store the one or more tests to be performed in the SIP. The test controller is instructed to conduct the one or more tests in the SIP.

Automatic test equipment method for testing system in a package devices

Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.

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College Station, TX, United States of America

Kevin Michael Troy