Kevin C Olson

This inventor holds 30 USPTO granted patents and 3 published patent applications, plus 1 CIPO patent and 4 EPO patents, primarily in Circuit Board Technology. Top assignees: Ppg Industries Ohio, Inc., Other. Active years: 1993-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kevin C Olson. Retrieved from https://idiyas.com/inventor/kevin-c-olson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 (Patent Applications = 3)

% Patents Active = 26.7

CIPO Patents = 1

EPO Patents = 4 (Patent Applications = 5)

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 125(Granted Patents)

Location History:

Alexandria, MN (US) (1993 - 1996)
Gibsonia, PA (US) (2001 - 2004)
Wexford, PA (US) (2004 - 2014)
Norman, OK (US) (2015)

Company Filing History:

27 out of 1,784

Ppg Industries Ohio, Inc.

patents

2 out of 834,453

Other

patents

where one patent can have more than one assignee

Years Active: 1993-2015

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Areas of Expertise:

Circuit Board

Via Design

Multi-Layer Assembly

Coating Composition

Polymerization

Food Can Coating

Dielectric Coating

Printed Circuit Board

Functional Compositions

Electrodepositable

High Density Interconnect

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9114506 - Apparatus and method for clamping mitered corners (2015-08-25),

2. 8629218 - Curable film-forming compositions containing ortho-hydroxyl aromatic functional acrylic polymers (2014-01-14),

3. 8598467 - Multi-layer circuit assembly and process for preparing the same (2013-12-03),

4. 8563648 - Coating composition comprising an alkoxysilane, a polysiloxane, and a plurality of particles (2013-10-22),

5. 8409982 - Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials (2013-04-02),

6. 8258411 - Printed circuit board with improved via design (2012-09-04),

7. 8141245 - Method of forming a circuit board with improved via design (2012-03-27),

8. 8065795 - Multi-layer circuit assembly and process for preparing the same (2011-11-29),

9. 8008188 - Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials (2011-08-30),

10. 7803415 - Methods for coating food cans (2010-09-28),

11. 7745508 - Compositions and methods for coating food cans (2010-06-29),

12. 7743494 - Process of fabricating a circuit board (2010-06-29),

13. 7690103 - Method of forming a printed circuit board with improved via design (2010-04-06),

14. 7679001 - Circuit board and method of manufacture thereof (2010-03-16),

15. 7666945 - Non-gelled curable compositions containing imide functional compositions (2010-02-23),

Title: Kevin C Olson - Inventor from Wexford, PA

Introduction: Kevin C Olson is a prolific inventor based in Wexford, Pennsylvania, known for his innovative contributions to various fields.

Latest Patents: Kevin C Olson holds several patents in the areas of technology and engineering, showcasing his dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Kevin C Olson has established himself as a leading figure in the world of inventions. His keen eye for detail and problem-solving skills have led to groundbreaking solutions in the industry.

Collaborations: Throughout his career, Kevin C Olson has collaborated with top research institutions, universities, and companies to bring his inventions to life. His ability to work in multidisciplinary teams has resulted in successful projects that have made a significant impact.

Conclusion: Kevin C Olson's passion for innovation and his relentless drive to create have solidified his position as a respected inventor in Wexford, PA, and beyond. His work continues to inspire future generations of inventors to think outside the box and pursue their ideas.

Profile summary based on public USPTO records.