Ppg Industries Ohio, Inc.

Other

Ppg Industries Chio, Inc.

Kevin C Olson

Alan E Wang

Gregory J McCollum

Thomas H Di Stefano

Ronald R Ambrose

James B O'Dwyer

Simion Coca

Steven R Zawacky

Linda K Anderson

Thomas C Moriarity

John M Dudik

Padmanabhan Sundararaman

Michael G Sandala

Peter Elenius

Laura A Kiefer-Liptak

Thomas W Goodman

Alan G Wang

Thomas H DiStefano

Kurt Gordon Olson

Karl F Schimmel

Charles M Kania

Dennis A Simpson

Michael J Pawlik

Brian Edward Woodworth

Craig A Wilson

Susan Fundy Donaldson

Shiryn Tyebjee

John E Schwendeman

Lance C Sturni

Leigh Ann Humbert

Lyle L Foringer

Frank C Williams

Robert Schmeltzer

Kurt G Olson

Susan F Donaldson

A kit for clamping and joining a miter joint between a first frame member and a second frame member comprising a band retaining member and a clamp band. The band retaining member has a base portion that is adapted to be positioned and attached adjacent the first and second frame members when the first and second frame members are together to form the mitered corner. The band retaining member has at least one band retainer extending from the base portion. The clamp band is wrapped around the first and second mitered frame members and about the at least one band retainer of the band retaining member in such a way that the clamp band is held in position while it extends across the mitered corner so as to exert a compressive force in a direction substantially perpendicular to the joint of the mitered corner.

Apparatus and method for clamping mitered corners

The present invention is directed to curable film-forming compositions comprising a film-forming resin and a crosslinking agent. The film-forming resin contains a polymer having functional aromatic groups derived from functional aromatic acids. The present invention further provides multi-component composite coating compositions comprising a first film-forming composition applied to a substrate to form a primer or base coat, and a second film-forming composition applied on top of the primer or base coat to form a top coat, the top coat comprising the composition described above. Coating compositions prepared from the curable compositions of the present invention demonstrate superior gloss and acid etch resistance properties, making them ideally suited for automotive applications.

Curable film-forming compositions containing ortho-hydroxyl aromatic functional acrylic polymers

A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.

Multi-layer circuit assembly and process for preparing the same

The present invention is directed to a coating composition, such as a substantially clear coating composition, which comprises (1) an alkoxysilane, (2) a polysiloxane, (3) a plurality of particles, and (4) curing agent that is reactive with the polysiloxane. The coating composition of the present invention can exhibit increased physical properties, such as scratch resistance, when compared to similar coating compositions that lack the components disclosed herein.

Coating composition comprising an alkoxysilane, a polysiloxane, and a plurality of particles

A method includes forming a first substrate by (a) applying an electrodepositable dielectric coating onto a conductive surface; (b) curing the dielectric coating; (c) depositing an adhesion layer and a seed layer onto the dielectric coating; (d) applying a layer of a first removable material to the seed layer; (e) forming openings in the first removable material to expose areas of the seed layer; (f) electroplating a first conductive material to the exposed areas of the seed layer; (g) applying a layer of a second removable material; (h) forming openings in the second removable material to expose areas of the first conductive material; (i) plating a second conductive material to the exposed areas of the first conductive material; (j) removing the first and second removable materials; (k) removing unplated portions of the seed layer; repeating steps (a) through (k) to form a second substrate; and laminating the first and second substrates together with a layer of dielectric material between the first and second substrates to form at least one interconnect between the first and second substrates.

Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials

A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Printed circuit board with improved via design

A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.

Method of forming a circuit board with improved via design

Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included.

A method is provided comprising: coating an electrically conductive core with a first removable material, creating openings in the first removable material to expose portions of the electrically conductive core, plating a conductive material onto the exposed portions of the electrically conductive core, coating the conductive material with a second removable material, removing the first removable material, electrophoretically coating the electrically conductive core with a dielectric coating, and removing the second removable material.

Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials

A composition for coating food cans is disclosed. The composition comprises a polyester, an acrylic copolymer and a crosslinker; the polyester and acrylic copolymer have been compatibilized in some way, such as through graft copolymerization. Methods for compatibilizing acrylics and polyesters are also disclosed as are methods for coating cans using compositions comprising acrylic and polyesters.

Methods for coating food cans

Compositions and methods for coating food cans

A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.

Process of fabricating a circuit board

Method of forming a printed circuit board with improved via design

Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.

Circuit board and method of manufacture thereof

The present invention is directed to a non-gelled, curable composition including at least one compound having a plurality of imide functional groups. The compound in particular contains a reaction product of at least one secondary monoamine and at least one maleimide, and is suitable for use in coatings and castings.

Non-gelled curable compositions containing imide functional compositions

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Wexford, PA, United States of America

Kevin C Olson