Irvine, CA, United States of America

Kevin (Kunzhong) Hu

This inventor holds 5 USPTO granted patents. Top assignee: Broadcom Corporation. Active years: 2013-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kevin (Kunzhong) Hu. Retrieved from https://idiyas.com/inventor/kevin-(kunzhong)-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 80.0

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2013-2017

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5 patents (USPTO):Explore Patents

Title: The Innovative Mind of Kevin (Kunzhong) Hu

Introduction

Kevin (Kunzhong) Hu is a distinguished inventor based in Irvine, CA, recognized for his significant contributions to the field of integrated circuit technology. With a total of five patents to his name, Hu has demonstrated his commitment to advancing the capabilities of semiconductor devices through innovative designs and methodologies.

Latest Patents

Among his latest patents, Hu has developed a thermal enhanced package utilizing an embedded substrate. This advanced integrated circuit (IC) device design incorporates an IC die with opposing first and second surfaces, a carrier attached to the die's first surface, and a laminate coupled to the carrier and the second surface. The inclusion of a trace on the laminate surface enables electrical coupling to a bond pad on the IC die, facilitating efficient communication with a circuit board.

Additionally, Hu's patent concerning the fabrication of wafer-level semiconductor packages with a pre-formed dielectric layer showcases cutting-edge improvements. This implementation involves the creation of a post-fabrication redistribution layer (post-Fab RDL) positioned between two dielectric layers on a wafer's surface. The design features a window created in the second dielectric layer, which exposes the post-Fab RDL for electrical contacts. Notably, one or both dielectric layers can be pre-formed and affixed to the wafer using a lamination process, enhancing efficiency in fabrication.

Career Highlights

Kevin Hu's career is highlighted by his role at Broadcom Corporation, where he has played a pivotal part in the development of innovative semiconductor solutions. His expertise and visionary approach have enabled the company to maintain a competitive edge in the rapidly evolving tech landscape.

Collaborations

Throughout his career, Hu has collaborated with esteemed colleagues, including Edward Law and Chonghua Zhong. Their combined efforts have led to groundbreaking advancements in integrated circuit technology and the further evolution of semiconductor packaging techniques.

Conclusion

Kevin (Kunzhong) Hu stands out as a prominent inventor whose work continues to shape the landscape of integrated circuit technology. Through his patents and collaborations, he not only enhances semiconductor designs but also contributes significantly to the innovation that drives the electronics industry forward.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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