The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Sep. 27, 2011
Edward Law, Ladera Ranch, CA (US);
Kevin (Kunzhong) HU, Irvine, CA (US);
Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);
Edward Law, Ladera Ranch, CA (US);
Kevin (Kunzhong) Hu, Irvine, CA (US);
Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
Embodiments for multi-chip and multi-substrate reconstitution based packaging are provided. Example packages are formed using substrates from a reconstitution. substrate panel or strip. The reconstitution substrate panel or strip may include known good substrates of same or different material types and/or same of different layer counts and sizes. As such, different combinations of reconstitution substrates and chips can be used within the same package, thereby allowing substrate customization according to semiconductor chip block(s) and types contained in the package.