The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Feb. 18, 2011
Applicants:
Kevin (Kunzhong) HU, Irvine, CA (US);
Edward Law, Ladera Ranch, CA (US);
Inventors:
Kevin (Kunzhong) Hu, Irvine, CA (US);
Edward Law, Ladera Ranch, CA (US);
Assignee:
Broadcom Corporation, Irvine, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/36 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/36 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract
An integrated circuit (IC) device is provided. The IC device includes an IC die having opposing first and second surfaces, a carrier coupled to the first surface of the IC die, a laminate coupled to the carrier and the second surface of the IC die, and a trace located on a surface of the laminate and electrically coupled to a bond pad located on the second surface of the IC die. The trace is configured to couple the bond pad to a circuit board.