Keunho Jang

Title: Keunho Jang: Innovator in Semiconductor Packaging

Introduction

Keunho Jang is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology. His work has been instrumental in advancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents is a semiconductor package that includes a package substrate with a redistribution layer featuring first and second pads. This design allows for improved connectivity and efficiency in semiconductor chips. Another notable patent is for a package frame that includes a plurality of unit regions and a unique wrinkled structure, enhancing the structural integrity and performance of semiconductor packages.

Career Highlights

Keunho Jang has worked with leading companies in the technology sector, including Samsung Electronics and Hyundai Motor Company. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Jang has collaborated with talented individuals such as Soojae Park and Geunwoo Kim. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Keunho Jang's contributions to semiconductor packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of technology and its applications in the modern world.