logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10147616 B1

PDFFull Text
Date of Patent:
Dec. 04, 2018

Filed:

Oct. 26, 2015

Package frame and method of manufacturing semiconductor package using the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Soojae Park, Asan-si, KR;

Geunwoo Kim, Asan-si, KR;

Keunho Jang, Yongin-si, KR;

Younjo Mun, Cheonan-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:

F. Chau & Associates, LLC

Primary Examiner:

Lex Malsawma

Assistant Examiner:

Xia Cross

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 21/50 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/50 (2013.01); H01L 21/561 (2013.01); H01L 23/13 (2013.01); H01L 24/97 (2013.01); H01L 23/49838 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A package frame includes a plurality of unit regions disposed on one surface of the package frame, a peripheral region surrounding the unit regions on the one surface, and a wrinkled structure disposed on the one surface in the peripheral region. A first surface of the wrinkled structure extends from the one surface and is disposed at a different level than the one surface. Each of the unit regions includes a plurality of conductive pads.

Find Patent Forward Citations

Quick Actions:

Park, Soojae. (2018). Package frame and method of manufacturing semiconductor package using the same (U.S. Patent No. 10147616). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10147616

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…