Younjo Mun

Title: Younjo Mun: Innovator in Semiconductor Packaging

Introduction

Younjo Mun is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit and technical expertise.

Latest Patents

Younjo Mun holds a patent for a "Package frame and method of manufacturing semiconductor package using the same." This patent describes a package frame that includes a plurality of unit regions on one surface, a peripheral region surrounding these unit regions, and a unique wrinkled structure in the peripheral region. The wrinkled structure extends from the surface and is positioned at a different level, enhancing the functionality of the semiconductor package. Each unit region is equipped with multiple conductive pads, which are essential for the performance of semiconductor devices.

Career Highlights

Younjo Mun is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to be at the forefront of semiconductor technology, contributing to advancements that impact various electronic devices.

Collaborations

Throughout his career, Younjo Mun has collaborated with talented individuals such as Soojae Park and Geunwoo Kim. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Younjo Mun's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent and work at Samsung Electronics Co., Ltd. highlight his role as a key player in advancing semiconductor technology.