Company Filing History:
Years Active: 2008-2014
Title: Keung Chau: Innovator in Semiconductor Technology
Introduction
Keung Chau is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative approaches have advanced the methods used in die bonding and adhesive transfer processes.
Latest Patents
One of his latest patents is a die bonding method utilizing a rotary wafer table. This invention involves an array of semiconductor components, where a first plurality of components is bonded onto one or more substrates. The process includes locating the components for pick-up by a transfer device, which then bonds each component onto a respective position on the substrates. After completing the first bonding, the carrier rotates to allow the second plurality of components to be picked up and bonded in a similar manner.
Another notable patent is the transfer apparatus for multiple adhesives. This invention allows for the transfer of different types of adhesives from separate containers to a substrate. A first stamping pin is used to move the first adhesive from its container to the substrate before bonding a die onto it. Subsequently, a second stamping pin transfers a second adhesive from another container to the substrate for bonding a second die.
Career Highlights
Keung Chau is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the semiconductor industry. His work has been instrumental in improving the efficiency and effectiveness of semiconductor component assembly.
Collaborations
He collaborates with talented coworkers, including Man Chung Ng and Wei Min Zhong, who contribute to the innovative environment at Asm Assembly Automation Limited.
Conclusion
Keung Chau's contributions to semiconductor technology through his patents and work at Asm Assembly Automation Limited highlight his role as a key innovator in the field. His advancements in die bonding and adhesive transfer processes are paving the way for future developments in semiconductor manufacturing.