Asm Assembly Automation Limited

Keung Chau

Man Chung Ng

Wing Fai Lam

Yang Yang

Choo Han Loh

Wei Min Zhong

An array of semiconductor components, comprising a first plurality of semiconductor components and a second plurality of semiconductor components held on a carrier, is bonded onto one or more substrates. The first plurality of semiconductor components is first located for pick-up by a transfer device, and each semiconductor component comprised in the first plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates. After the first plurality of semiconductor components have been picked up and bonded, the carrier is rotated and the second plurality of semiconductor components is located for pick-up by the transfer device. Thereafter, each semiconductor component comprised in the second plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates.

Die bonding method utilizing rotary wafer table

Multiple types of adhesives contained in separate containers are transferred from a supply of adhesives to a substrate. A first stamping pin is moved to a position of a first container containing a first adhesive, and the first adhesive is transferred with the first stamping pin from the first container to the substrate before bonding a first die onto the first adhesive. A second stamping pin is then moved to a position of a second container containing a second adhesive, and the second adhesive is transferred with the second stamping pin from the second container to the substrate before bonding a second die onto the second adhesive.

Transfer apparatus for multiple adhesives

A die sorting apparatus for a wafer is provided that associates logical positions of each die from a map file for storing records of testing information based upon testing performed on individual dice comprised in the wafer with its physical position as illustrated by an image acquired by an image capturing device showing physical positions of the dice, after the dice have been singulated. A processing device can thus determine actual physical positions of the dice for reference by a die pick-up device configured to selectively pick up dice that meet predetermined criteria according to the testing information from their actual physical positions as determined.

Growing community of inventors

Hong Kong, China

Keung Chau