The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Dec. 08, 2004
Wei Min Zhong, Hong Kong, CN;
Yang Yang, Hong Kong, CN;
Choo Han Loh, Hong Kong, CN;
Keung Chau, Hong Kong, CN;
Wei Min Zhong, Hong Kong, CN;
Yang Yang, Hong Kong, CN;
Choo Han Loh, Hong Kong, CN;
Keung Chau, Hong Kong, CN;
ASM Assembly Automation Ltd., Hong Kong, HK;
Abstract
A die sorting apparatus for a wafer is provided that associates logical positions of each die from a map file for storing records of testing information based upon testing performed on individual dice comprised in the wafer with its physical position as illustrated by an image acquired by an image capturing device showing physical positions of the dice, after the dice have been singulated. A processing device can thus determine actual physical positions of the dice for reference by a die pick-up device configured to selectively pick up dice that meet predetermined criteria according to the testing information from their actual physical positions as determined.