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For the Inventor, By the Inventor

Cranston, RI, United States of America

Kenneth Burton Gilleo

USPTO Granted Patents = 14

Average Co-Inventor Count = 1.8

ph-index = 10

Forward Citations = 513(Granted Patents)


Location History:

  • West Kingston, RI (US) (1995 - 1997)
  • Erwinna, PA (US) (2000)
  • Chepachet, RI (US) (1999 - 2001)
  • Cranston, RI (US) (2001 - 2005)

Company Filing History:

goldMedal5 out of 1,854 
 
Adeia Semiconductor Bonding Technologies Inc.
 patents
silverMedal5 out of 49 
 
Fry's Metals, Inc.
 patents
bronzeMedal2 out of 22 
 
Alpha Metals, Inc.
 patents
4. 2 out of 3 
 
Cookson Electronics, Inc.
 patents

Years Active: 1995-2005

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14 patents (USPTO):Explore Patents
1. 6936644 - Releasable microcapsule and adhesive curing system using the same (2005-08-30),
2. 6863447 - Photon-conducting media alignment using a thermokinetic material (2005-03-08),
3. 6838372 - Via interconnect forming process and electronic component product thereof (2005-01-04),
4. 6323062 - Wafer coating method for flip chips (2001-11-27),
5. 6252301 - Compliant semiconductor chip assemblies and methods of making same (2001-06-26),
6. 6228681 - Flip chip having integral mask and underfill providing two-stage bump formation (2001-05-08),
7. 6228678 - Flip chip with integrated mask and underfill (2001-05-08),
8. 6204455 - Microelectronic component mounting with deformable shell terminals (2001-03-20),
9. 6194788 - Flip chip with integrated flux and underfill (2001-02-27),
10. 6020220 - Compliant semiconductor chip assemblies and methods of making same (2000-02-01),
11. 5971253 - Microelectronic component mounting with deformable shell terminals (1999-10-26),
12. 5637176 - Methods for producing ordered Z-axis adhesive materials, materials so (1997-06-10),
13. 5531942 - Method of making electroconductive adhesive particles for Z-axis (1996-07-02),
14. 5477611 - Method of forming interface between die and chip carrier (1995-12-26),

Title: Innovations of Kenneth Burton Gilleo

Introduction

Kenneth Burton Gilleo is a notable inventor based in Cranston, RI (US). He holds a total of 14 patents that showcase his contributions to the field of adhesive technologies and photon-conducting media.

Latest Patents

One of his latest patents is for a releasable microcapsule and adhesive curing system. This invention involves an uncured epoxy adhesive that comprises a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator includes an infrared absorber, an accelerator, and a wall that covers the accelerator's surface. The curing process is initiated by exposing the adhesive to infrared energy, which is absorbed by the infrared absorber, leading to the disintegration of the wall and allowing the accelerator to interact with the other components. Another significant patent is for photon-conducting media alignment using a thermokinetic material. This invention aligns photon-conducting media, such as optical fibers, by coupling them with a thermokinetic structure, which may include a shape memory alloy. A photon beam directed onto the thermokinetic structure locally heats it, causing contraction and alignment of the media.

Career Highlights

Throughout his career, Kenneth has worked with several companies, including Adeia Semiconductor Bonding Technologies Inc. and Fry's Metals, Inc. His work has significantly impacted the development of advanced adhesive systems and media alignment technologies.

Collaborations

Kenneth has collaborated with notable individuals in his field, including David B Blumel and Konstantine N Karavakis. Their combined expertise has contributed to the success of various projects and innovations.

Conclusion

Kenneth Burton Gilleo's innovative work in adhesive technologies and photon-conducting media has established him as a prominent figure in the field. His patents reflect a commitment to advancing technology and improving existing systems.

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