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Kenji Wada

This inventor holds 16 USPTO granted patents. Top assignee: Seiko Epson Corporation. Active years: 2003-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenji Wada. Retrieved from https://idiyas.com/inventor/kenji-wada-hmo2udnv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16

% Patents Active = 75.0

Average Co-Inventor Count = 1.5

ph-index = 6

Forward Citations = 417(Granted Patents)

Location History:

Nagano-ken, JP (2004)
Suwa-gun, JP (2005)
Suwa, JP (2003 - 2006)
Fujimi-machi, JP (2004 - 2011)
Fujimi, JP (2014)

Company Filing History:

16 out of 34,268

Seiko Epson Corporation

Years Active: 2003-2014

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8921162 - Method for manufacturing electronic component, and electronic apparatus (2014-12-30),

2. 8888229 - Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate (2014-11-18),

3. 7879633 - Miniature optical element for wireless bonding in an electronic instrument (2011-02-01),

4. 7723243 - Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus (2010-05-25),

5. 7544973 - Miniature optical element for wireless bonding in an electronic instrument (2009-06-09),

6. 7276738 - Miniature optical element for wireless bonding in an electronic instrument (2007-10-02),

7. 7250377 - Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus (2007-07-31),

8. 7102219 - Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument (2006-09-05),

9. 7074632 - Miniature optical element for wireless bonding in an electronic instrument (2006-07-11),

10. 7033935 - Semiconductor device and method for manufacturing the same (2006-04-25),

11. 6962865 - Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument (2005-11-08),

12. 6852621 - Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment (2005-02-08),

13. 6720661 - Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument (2004-04-13),

14. 6703689 - Miniature optical element for wireless bonding in an electronic instrument (2004-03-09),

15. 6682948 - Semiconductor device and method for manufacturing the same (2004-01-27),

Title: Kenji Wada - Innovative Inventor from Fujimi-machi, JP

Introduction: Kenji Wada is a highly skilled inventor hailing from Fujimi-machi, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Kenji Wada holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With over two decades of experience in the industry, Kenji Wada has worked with leading research institutions and universities to develop cutting-edge solutions that have revolutionized the way we approach complex challenges.

Collaborations: Throughout his career, Kenji Wada has collaborated with top companies and fellow inventors, fostering a culture of creativity and excellence that has led to numerous successful projects and inventions.

Conclusion: Kenji Wada's passion for innovation and his dedication to pushing the boundaries of what is possible make him a true pioneer in the world of technology and a source of inspiration for aspiring inventors worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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