The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
May. 17, 2013
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Kenji Wada, Fujimi, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/055 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 24/81 (2013.01); H01L 23/055 (2013.01);
Abstract
A method for manufacturing an electronic component includes mounting a vibrating element on each singulation region of a base substrate, joining the surface of a lid substrate where grooves are arranged to the base substrate via low-melting glass so as to cover a functional element in each singulation region, thereby obtaining a laminate, and performing singulation in each singulation region by breaking the laminate along grooves.