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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8888229 B1

PDFFull Text
Date of Patent:
Nov. 18, 2014

Filed:

Aug. 25, 2006

Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate

Applicants:

Tsuyoshi Shintate, Fujimi, JP;

Koichi Mizugaki, Suwa, JP;

Kazuaki Sakurada, Suwa, JP;

Kenji Wada, Fujimi, JP;

Inventors:

Tsuyoshi Shintate, Fujimi, JP;

Koichi Mizugaki, Suwa, JP;

Kazuaki Sakurada, Suwa, JP;

Kenji Wada, Fujimi, JP;

Assignee:

Seiko Epson Corporation, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Robert Vetere

Int. Cl.
CPC ...
B05D 7/00 (2006.01); H01L 21/768 (2006.01); H05K 3/12 (2006.01); H01L 27/12 (2006.01); H01L 21/288 (2006.01); G02F 1/1362 (2006.01); G02F 1/1337 (2006.01);
U.S. Cl.
CPC ...
H05K 3/125 (2013.01); G02F 2001/136295 (2013.01); H05K 2203/013 (2013.01); H01L 21/76838 (2013.01); H01L 27/1214 (2013.01); H05K 2203/1476 (2013.01); H01L 21/288 (2013.01); G02F 1/133711 (2013.01); H05K 2203/095 (2013.01); H05K 2203/1173 (2013.01);
Abstract

A method for forming a layer comprises (a) disposing a first droplet to two parts on an underlayer surface so as to form two dot patterns isolated each other on the underlayer surface, (b) fixing the two dot patterns to the underlayer surface, (c) giving lyophilicity with respect to a second droplet to at least the underlayer surface between the two dot patterns, and (d) disposing the second droplet to the underlayer surface between the two dot patterns so as to join the two dot patterns after the step (c).

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