Kenji Kiya

Title: Kenji Kiya: Innovator in Flexible Printed Circuit Technology

Introduction

Kenji Kiya is a prominent inventor based in Tokyo, Japan, known for his contributions to the field of flexible printed circuit technology. With a total of seven patents to his name, Kiya has made significant advancements that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest innovations is a heater that includes a flexible printed wiring board. This heater features a base film and a metal foil on one side, with a heater circuit portion that generates heat when energized. Additionally, it incorporates a heat conductive foil portion that remains in a non-energized state, providing improved thermal management. Another notable patent is the crimp terminal-equipped flexible printed circuit board. This invention consists of a first flexible printed circuit board with a base film and a metal foil circuit. It includes multiple crimp terminals that penetrate the board and an insulating reinforcing film that enhances durability.

Career Highlights

Throughout his career, Kenji Kiya has worked with notable companies such as Nippon Mektron Limited and Hitachi-LG Data Storage, Inc. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technology in the electronics industry.

Collaborations

Kiya has collaborated with talented individuals in his field, including Shunsuke Aoyama and Katsuhiko Kimura. These partnerships have fostered innovation and have led to the development of advanced technologies.

Conclusion

Kenji Kiya's work in flexible printed circuit technology exemplifies his commitment to innovation and excellence. His patents reflect a deep understanding of electronic design and functionality, making him a significant figure in the industry.