The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Jan. 14, 2021
Applicant:
Nippon Mektron, Ltd., Tokyo, JP;
Inventors:
Kenji Kiya, Tokyo, JP;
Tomoki Kanayama, Tokyo, JP;
Assignee:
NIPPON MEKTRON, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H05K 1/0293 (2013.01); H05K 1/032 (2013.01); H05K 1/16 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/062 (2013.01); H05K 2201/10181 (2013.01);
Abstract
A printed-circuit board includes: a film-shaped thermoplastic base member having plasticity; a pattern fuse formed from a metal foil layer provided on a principal surface of the base member; a cover member covering at least part of the pattern fuse from an opposite side of the base member; and a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side.