The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Jun. 04, 2021
Applicant:

Nippon Mektron, Ltd., Tokyo, JP;

Inventors:

Tsukasa Watanabe, Tokyo, JP;

Shunsuke Tomita, Tokyo, JP;

Shuzo Yamada, Tokyo, JP;

Kenji Kiya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K 7/22 (2006.01); G01R 31/396 (2019.01); G01K 1/16 (2006.01); H05K 1/02 (2006.01); G01K 1/14 (2021.01); G01K 1/18 (2006.01); H01M 10/48 (2006.01); H05K 1/18 (2006.01); G01R 31/382 (2019.01); G01K 1/08 (2021.01);
U.S. Cl.
CPC ...
G01K 7/22 (2013.01); G01K 1/14 (2013.01); G01K 1/16 (2013.01); G01R 31/396 (2019.01); H05K 1/028 (2013.01); G01K 1/08 (2013.01); G01K 1/18 (2013.01); G01R 31/382 (2019.01); H01M 10/486 (2013.01); H05K 1/189 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10196 (2013.01); Y02E 60/10 (2013.01);
Abstract

Provided is a temperature measuring device which includes: a flexible printed circuit board with wiring; a thermistor element; a heat collecting plate; and a pressing member. The flexible printed circuit board is configured to be attached to a case that is fixed to an object to be measured, the thermistor element is electrically connected to the wiring, the heat collecting plate is disposed on a side opposite to the thermistor element via the flexible printed circuit board so as to be pressed against a temperature measuring point in the object to be measured, and the pressing member is made of a foam material and is configured to be compressed when the case is fixed to the object to be measured and to press the heat collecting plate against the object to be measured.


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