This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Toray Engineering Company, Limited. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Kenji Hamakawa: Innovator in Mounting Technology
Introduction
Kenji Hamakawa is a notable inventor based in Otsu, Japan. He has made significant contributions to the field of mounting technology, particularly through his innovative patent that enhances the precision of component placement.
Latest Patents
Hamakawa holds a patent for a "Mounting device and mounting method." This invention includes a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism is designed to acquire position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates the positional deviation between a chip component and a substrate based on this information. It then performs alignment by adjusting the mounting head and/or the substrate stage accordingly. This process ensures that the chip component and substrate are aligned accurately while being imaged simultaneously within a depth of field, ultimately bringing them into close contact.
Career Highlights
Kenji Hamakawa is associated with Toray Engineering Company, Limited, where he has been instrumental in developing advanced mounting technologies. His work has contributed to improving the efficiency and accuracy of component assembly in various applications.
Collaborations
Hamakawa has collaborated with notable colleagues, including Katsumi Terada and Takashi Hare. Their combined expertise has furthered the development of innovative solutions in the field of mounting technology.
Conclusion
Kenji Hamakawa's contributions to mounting technology through his patent demonstrate his commitment to innovation and precision in engineering. His work continues to influence the industry positively.