Hiratsuka, Japan

Kenji Goto



Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Tsukuba, JP (2016)
  • Hiratsuka, JP (2019 - 2023)
  • Isehara, JP (2022 - 2023)

Company Filing History:


Years Active: 2016-2024

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11 patents (USPTO):Explore Patents

Title: Kenji Goto: Innovator in Shape-Memory Alloys

Introduction

Kenji Goto is a prominent inventor based in Hiratsuka, Japan. He has made significant contributions to the field of materials science, particularly in the development of shape-memory alloys. With a total of 11 patents to his name, Goto's work has implications in various industries, especially in medical applications.

Latest Patents

One of Goto's latest patents involves a shape-memory alloy that includes a Au—Cu—Al alloy. This alloy contains 20 at % or more and 40 at % or less Cu, and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. The alloy exhibits a Vickers hardness of 360 Hv or less, making it suitable for various applications. This invention is notable for its biocompatibility and ability to function in a magnetic environment. Another significant patent is for a Pt—Co based alloy for medical use, which includes Pt, Co, Cr, Ni, and Mo. This alloy can be utilized in medical devices such as catheters, embolic coils, and stents.

Career Highlights

Kenji Goto has worked with notable organizations, including Tanaka Kikinzoku Kogyo K.K. and the Tokyo Institute of Technology. His experience in these institutions has allowed him to refine his expertise in materials science and innovation.

Collaborations

Some of Goto's notable coworkers include Kunihiro Shima and Yasushi Masahiro. Their collaborative efforts have contributed to advancements in the field of shape-memory alloys and their applications.

Conclusion

Kenji Goto's innovative work in shape-memory alloys has positioned him as a key figure in materials science. His patents reflect a commitment to advancing technology for medical applications and beyond.

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