The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Feb. 28, 2019
Applicants:

Tokyo Institute of Technology, Tokyo, JP;

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Hideki Hosoda, Tokyo, JP;

Akira Umise, Tokyo, JP;

Kenji Goto, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22F 1/00 (2006.01); A61L 27/04 (2006.01); A61L 27/50 (2006.01); A61L 29/02 (2006.01); A61L 29/14 (2006.01); A61L 31/02 (2006.01); A61L 31/14 (2006.01); C22C 5/02 (2006.01); C22F 1/14 (2006.01);
U.S. Cl.
CPC ...
C22F 1/006 (2013.01); A61L 27/047 (2013.01); A61L 27/50 (2013.01); A61L 29/02 (2013.01); A61L 29/14 (2013.01); A61L 31/022 (2013.01); A61L 31/14 (2013.01); C22C 5/02 (2013.01); C22F 1/14 (2013.01); A61L 2400/16 (2013.01); A61L 2430/12 (2013.01);
Abstract

The present invention provides a shape-memory alloy including a Au—Cu—Al alloy having 20 at % or more and 40 at % or less Cu and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. The shape-memory alloy has a Vickers hardness of 360 Hv or less. The Au—Cu—Al alloy of the present invention is an alloy capable of developing both biocompatibility and a shape-memory effect, and further capable of achieving artifactlessness in a magnetic environment. The Au—Cu—Al alloy can be produced by heat-treating a clad material formed of a combination of a hollow material made of a Au—Cu alloy and a core material made of metallic Al at 500° C. or more and 700° C. or less.


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