Company Filing History:
Years Active: 2020-2024
Title: Akira Umise: Innovator in Shape-Memory Alloys
Introduction
Akira Umise is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of shape-memory alloys. With a total of 3 patents, his work has garnered attention for its innovative applications and potential benefits.
Latest Patents
Umise's latest patents include advancements in shape-memory alloys and shape-memory alloy wires. One of his notable inventions is a shape-memory alloy that consists of a Au—Cu—Al alloy, which contains 20 at % or more and 40 at % or less Cu, and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. This alloy exhibits a Vickers hardness of 360 Hv or less and is capable of developing both biocompatibility and a shape-memory effect, while also achieving artifactlessness in a magnetic environment. Another significant patent is for an artifactless superelastic alloy, which includes a Au—Cu—Al alloy that contains Cu in an amount of 20 atom % or more and 40 atom % or less, Al in an amount of 15 atom % or more and 25 atom % or less, and Au as a balance. This superelastic alloy demonstrates superelasticity in a normal temperature range and minimizes artifact generation in magnetic fields.
Career Highlights
Throughout his career, Umise has worked with esteemed institutions such as the Tokyo Institute of Technology and Tanaka Kikinzoku Kogyo Co., Ltd. His research has focused on the practical applications of shape-memory alloys in various fields, including medical devices and engineering.
Collaborations
Umise has collaborated with notable colleagues, including Kenji Goto and Hideki Hosoda. Their combined expertise has contributed to the advancement of materials science and the development of innovative technologies.
Conclusion
Akira Umise's contributions to the field of shape-memory alloys highlight his role as a leading inventor in materials science. His innovative patents and collaborations continue to influence the industry and pave the way for future advancements.
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