Kenichi Ueno

Title: Kenichi Ueno: Innovator in Copper Plating Technology

Introduction

Kenichi Ueno is a notable inventor based in Kanagawa, Japan, recognized for his contributions to the field of electroplating technology. He holds three patents that focus on innovative methods for copper plating, which are essential in semiconductor manufacturing.

Latest Patents

Ueno's latest patents include a process for copper-plating a wafer using an anode with an iridium oxide coating. This process involves electroplating a semiconductor wafer with an electrode that consists of a corrosion-resistant metal substrate and a coat primarily made of iridium oxide. The wafer acts as a cathode in a solution containing copper ions. Another significant patent is a method of copper plating that utilizes an electrolytic plating cell with a diaphragm separating the anode and cathode chambers. This method ensures a constant copper ion concentration in the electrolyte solution, enhancing the efficiency of the plating process.

Career Highlights

Throughout his career, Kenichi Ueno has worked with several companies, including Permelec Electrode Ltd. and Almex Inc. His experience in these organizations has contributed to his expertise in electroplating technologies and innovations.

Collaborations

Ueno has collaborated with notable professionals in his field, including Kazuhiro Hirao and Genzo Yamane. These collaborations have likely enriched his work and led to advancements in copper plating techniques.

Conclusion

Kenichi Ueno's innovative patents and career achievements highlight his significant role in the advancement of copper plating technology. His work continues to influence the semiconductor industry and showcases the importance of innovation in manufacturing processes.