The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Mar. 03, 2000
Setsuro Ogata, Kanagawa, JP;
Kenichi Ueno, Kanagawa, JP;
Permelec Electrode Ltd., Kanagawa, JP;
Abstract
A process for copper-plating a wafer which comprises electroplating a semiconductor wafer with an electrode comprising a corrosion-resistant metal substrate and a coat mainly composed of iridium oxide provided on the substrate as an anode and the wafer as a cathode in a solution containing copper ion. The anode is preferably an insoluble electrode comprising a corrosion-resistant metal substrate and a coat mainly composed of iridium oxide and further containing a metal or metal oxide selected from platinum, tantalum, titanium, niobium and oxides of these metals provided on the substrate. A neutral membrane or ion exchange membrane may be interposed between the anode and the cathode as a separating membrane.