Kenichi Kaneda

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignees: Nec Corporation, Sumitomo Bakelite Company Limited. Active years: 1992-2014.

USPTO Granted Patents = 5 (Patent Applications = 2)

% Patents Active = 60.0

Average Co-Inventor Count = 1.9

ph-index = 3

Forward Citations = 27(Granted Patents)

Location History:

Utsunomiya, JP (2013)
Tokyo, JP (1992 - 2014)

Company Filing History:

Sumitomo Bakelite Company Limited

patents

where one patent can have more than one assignee

Years Active: 1992-2014

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5 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8754337 - Printed wiring board fabrication method, printed wiring board, multilayer printed wiring board, and semiconductor package (2014-06-17),

2. 8455765 - Laminated body, method of manufacturing substrate, substrate, and semiconductor device (2013-06-04),

3. 5302852 - Semiconductor device package having a low profile structure and high (1994-04-12),

4. 5284899 - Resin paste for tight sealing (1994-02-08),

5. 5087963 - Glass-sealed semiconductor device (1992-02-11),

Title: Kenichi Kaneda: Innovator in Printed Wiring Board Technology

Introduction

Kenichi Kaneda is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 5 patents. His work focuses on improving the reliability and efficiency of semiconductor packaging.

Latest Patents

Kaneda's latest patents include a variety of innovations aimed at enhancing printed wiring board fabrication. One notable patent is a method for fabricating a printed wiring board that suppresses warping and improves the yield of semiconductor chip mounting. This method involves applying a laser from both sides of a core layer to create through-holes. Another patent details a laminated body that includes a resin layer with a core portion embedded, designed to facilitate the formation of via-holes. This innovation also encompasses a method for manufacturing substrates and semiconductor devices that utilize this advanced laminated body.

Career Highlights

Throughout his career, Kenichi Kaneda has worked with notable companies such as NEC Corporation and Sumitomo Bakelite Company Limited. His experience in these organizations has allowed him to refine his expertise in printed wiring board technology and semiconductor packaging.

Collaborations

Kaneda has collaborated with esteemed colleagues, including Akio Tanda and Junpei Morimoto. These partnerships have contributed to the advancement of technology in their respective fields.

Conclusion

Kenichi Kaneda's innovative work in printed wiring board technology has significantly impacted the semiconductor industry. His patents reflect a commitment to enhancing the reliability and efficiency of electronic devices.