The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 1994
Filed:
Feb. 23, 1993
Applicant:
Inventors:
Kenichi Kaneda, Tokyo, JP;
Akio Tanda, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257704 ; 257710 ; 257701 ;
Abstract
A semiconductor device includes a semiconductor element, a base, a cap, leads, and low-melting glass. The semiconductor element is mounted on the base, and the base consists of high-purity alumina and has a thickness of 0.5 mm or less. The cap is arranged on the base to cover the semiconductor element, consists of translucent alumina, and has a thickness of 0.4 mm or less. The leads extend out of the semiconductor device to be interposed between the base and the cap, and are electrically connected to the semiconductor element. The low-melting glass integrally and hermetically seals the base, the leads, and the cap.