Kenichi Kamiyama

Title: Kenichi Kamiyama: Innovator in Printed Wiring Board Technology

Introduction

Kenichi Kamiyama is a notable inventor based in Shimodate, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 6 patents. His work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

Kamiyama's latest patents include an adhesion assisting agent-bearing metal foil and a production method for printed wiring boards. The first invention relates to a metal foil that incorporates a layer of an adhesion assisting agent containing an epoxy resin. This layer has a thickness ranging from 0.1 to 10 micrometers. The second patent describes a printed wiring board that features a conductor circuit with a copper layer adjacent to an insulating layer, ensuring that gold plating is accurately deposited without defects.

Career Highlights

Kenichi Kamiyama is currently employed at Hitachi Chemical Company, Ltd. His work has been instrumental in advancing the technology behind printed wiring boards, making them more efficient and reliable for various applications.

Collaborations

Throughout his career, Kamiyama has collaborated with notable colleagues, including Kenji Takai and Norio Moriike. These partnerships have contributed to the innovative developments in his field.

Conclusion

Kenichi Kamiyama's contributions to printed wiring board technology exemplify his dedication to innovation. His patents reflect a commitment to improving electronic component performance, making him a significant figure in the industry.