The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Jan. 28, 2005
Kenji Takai, Oyama, JP;
Norio Moriike, Shimodate, JP;
Kenichi Kamiyama, Shimodate, JP;
Takako Watanabe, Shimodate, JP;
Shin Takanezawa, Shimodate, JP;
Koji Morita, Mooka, JP;
Katsuyuki Masuda, Shimodate, JP;
Kiyoshi Hasegawa, Yuki, JP;
Kenji Takai, Oyama, JP;
Norio Moriike, Shimodate, JP;
Kenichi Kamiyama, Shimodate, JP;
Takako Watanabe, Shimodate, JP;
Shin Takanezawa, Shimodate, JP;
Koji Morita, Mooka, JP;
Katsuyuki Masuda, Shimodate, JP;
Kiyoshi Hasegawa, Yuki, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.