The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Aug. 10, 2007
Applicants:
Kenji Takai, Oyma, JP;
Norio Moriike, Shimodate, JP;
Kenichi Kamiyama, Shimodate, JP;
Katsuyuki Masuda, Shimodate, JP;
Kiyoshi Hasegawa, Yuki, JP;
Inventors:
Kenji Takai, Oyma, JP;
Norio Moriike, Shimodate, JP;
Kenichi Kamiyama, Shimodate, JP;
Katsuyuki Masuda, Shimodate, JP;
Kiyoshi Hasegawa, Yuki, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.