Hitachi Chemical Company, Ltd.

Kenichi Kamiyama

Katsuyuki Masuda

Kiyoshi Hasegawa

Kenji Takai

Norio Moriike

Shin Takanezawa

Koji Morita

Takako Watanabe

The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 &#x3bc;m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 &#x3bc;m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

Formation method of metal layer on resin layer

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Shimodate, Japan

Kenichi Kamiyama